Stress | Ref. | Abbv. | Conditions | #Lots/SS per lot | Duration/Accept |
MSL Preconditioning Must be performed prior to: THB, HAST, TC, AC & UHAST | JESD22-A113 | PC | Per appropriate MSL level per J-STD-020 | Electrical Test (optional) |
|
High Temperature Storage | JESD22-A103 JESD22-A113 |
HTSL | 150C + Preconditioning if Required | 3 Lots/25 units | 1000 hrs/0 fail |
Temperature Humidity Bias (Std 85/85) | JESD22-A101 | THB | 85C/85%RH, Vccmax | 3 Lots/25 units | 1000 hrs/0 fail |
Temperature Humidity Bias (Highly Accelerated Temperature and Humidity Stress) |
JESD22-A110 | HAST | 130C/85%RH, Vccmax | 3 Lots/25 units | 96 hrs/0 fail |
110C/85%RH, Vccmax | 3 Lots/25 units | 264 hrs/0 fail | |||
Temperature Cycling | JESD22-A104 | TC | B -55C ~ +125C | 3 Lots/25 units | 700 cycles/0 fail |
G -40C ~ +125C | 850 cycles/0 fail | ||||
C -65C ~ +150C | 500 cycles/0 fail | ||||
K 0C ~ +125C | 1500 cycles/0 fail | ||||
J 0C ~ +100C | 2300 cycles/0 fail | ||||
Unbiased Temperature/Humidity (Unbiased HAST) |
JESD22-A118 | UHAST | 130C/85%RH | 3 Lots/25 units | 96 hrs/0 fail |
110C/85%RH | 264 hrs/0 fail | ||||
Unbiased Temperature/Humidity (Autoclave) |
JESD22-A102 | AC | 121C/100% RH | 3 Lots/25 units | 96 hrs/0 fail |
Solder Ball Shear | JESD22-B117 | SBS | Characterization | 30 balls/5 units | |
Bond Pull Strength | M2011 | BPS | cHaracterization, Pre Encapsulation | 30 bonds/5 units | Ppk>=1.66 or Cpk>=1.33 |
Bond Shear | JESD22-B116 | BS | cHaracterization, Pre Encapsulation | 30 bonds/5 units | Ppk>=1.66 or Cpk>=1.33 |
Solderability | M2003 JESD22-B102 |
SD | Characterization | 3 Lots/22 leads | 0 fail |
Tin Whisker Acceptance | JESD22-A121 per JESD201 |
WSR | Characterization per JESD201 | See JESD201 | See JESD201 |