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非气密性封装器之可靠性测试条件和方法/Qualification test for components in nonhermetic packages

Stress Ref. Abbv. Conditions #Lots/SS per lot Duration/Accept
MSL Preconditioning Must be performed prior to: THB, HAST, TC, AC & UHAST JESD22-A113 PC Per appropriate MSL level per J-STD-020   Electrical Test
(optional)
High Temperature Storage JESD22-A103
JESD22-A113
HTSL 150C + Preconditioning if Required 3 Lots/25 units 1000 hrs/0 fail
Temperature Humidity Bias (Std 85/85) JESD22-A101 THB 85C/85%RH, Vccmax 3 Lots/25 units 1000 hrs/0 fail
Temperature Humidity Bias
(Highly Accelerated Temperature and Humidity Stress)
JESD22-A110 HAST 130C/85%RH, Vccmax 3 Lots/25 units 96 hrs/0 fail
110C/85%RH, Vccmax 3 Lots/25 units 264 hrs/0 fail
Temperature Cycling JESD22-A104 TC B -55C ~ +125C 3 Lots/25 units 700 cycles/0 fail
G -40C ~ +125C 850 cycles/0 fail
C -65C ~ +150C 500 cycles/0 fail
K 0C ~ +125C 1500 cycles/0 fail
J 0C ~ +100C 2300 cycles/0 fail
Unbiased Temperature/Humidity
(Unbiased HAST)
JESD22-A118 UHAST 130C/85%RH 3 Lots/25 units 96 hrs/0 fail
110C/85%RH 264 hrs/0 fail
Unbiased Temperature/Humidity
(Autoclave)
JESD22-A102 AC 121C/100% RH 3 Lots/25 units 96 hrs/0 fail
Solder Ball Shear JESD22-B117 SBS Characterization 30 balls/5 units  
Bond Pull Strength M2011 BPS cHaracterization, Pre Encapsulation 30 bonds/5 units Ppk>=1.66 or Cpk>=1.33
Bond Shear JESD22-B116 BS cHaracterization, Pre Encapsulation 30 bonds/5 units Ppk>=1.66 or Cpk>=1.33
Solderability M2003
JESD22-B102
SD Characterization 3 Lots/22 leads 0 fail
Tin Whisker Acceptance JESD22-A121
per JESD201
WSR Characterization per JESD201 See JESD201 See JESD201

 

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